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Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. It requires a cure at only 80°C for 1.5 to 2 hours. To optimize performance properties a post cure of 1-2 hours at 80°C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many plastics. It is formulated for bonding, sealing and small encapsulating applications.
EP5TC-80 is electrically insulating, with a volume resistivity greater than 1014 ohm-cm. It features a low thermal resistance of 6-10 x 10-6 K·m2/W and can be applied in very thin sections due to its ultra-fine particle filler. This high strength system has a tensile modulus exceeding 1.5 million psi, and a compressive strength ranging between 25,000 and 27,000 psi.
EP5TC-80 exhibits good dimensional stability with a low shrinkage upon cure, a Shore D hardness of 90-100, and an elongation of 0.5 to 1.5%. It is serviceable over the temperature range of -50°C to +150°C and has a glass transition temperature of 110-115°C. Packaging is available in 3 cc, 5 cc, 10 cc and 30 cc syringes and ships in dry ice.
Master Bond EP5TC-80 is a thermally conductive, electrically insulating, one part epoxy system for bonding, sealing and small encapsulating applications. It meets NASA low outgassing requirements. Read more about Master Bond’s thermally conductive adhesives at https://www.masterbond.com/properties/thermally-conductive-epoxy-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: firstname.lastname@example.org.
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James Brenner, Marketing Manager
MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
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