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LATEST PRODUCT

Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that...

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TECH TIPS

Importance of Optical Transmittance
Understanding Joint Design to Optimize Adhesive Bonding
Innovative Adhesives Provide Superior Heat Dissipation
Micro Electromechanical Systems (MEMS) Technology
Epoxy for Kapton Bonding

LATEST WHITE PAPER

Adhesives for Cryogenic Applications

What are the challenges facing applications that operate at cryogenic temperatures? What effect do these low temperatures...

INDUSTRIAL CERTIFICATIONS

USP Class VI for biocompatibility
ISO 10993-5 for cytotoxicity
NASA low outgassing
FDA CFR 175.300 & 175.105
MIL-STD-810G for fungus resistance
MIL-STD-883J for thermal stability
FAR 25.853(a) for flame retardancy
UL 94V-0 & UL 94V-1
UL 1203 for explosion-proof
85°C/85% RH
See all certifications