The graph below displays the lap shear strength of various Master Bond epoxy adhesives for bonding polycarbonate to polycarbonate. Testing was based on ASTM D1002, where two polycarbonate coupons were bonded together and then pulled apart in shear. In order to achieve optimal bond strength, the 4 x 1 x 1/16 inch coupons were roughened, and then cleaned with acetone prior to bonding.
As shown in the graph, EP31ND offers superior bond strength to polycarbonate. However, when choosing the proper adhesive, there are many other factors to consider outside of mechanical strength. Some of these factors include operating temperature range, chemical resistance requirements, as well as handling and processing considerations. For example, if an application requires resistance to some acids / chemicals, EP21ARHT would be desirable. If optical clarity with high light transmission is required, EP30-2 would be a good fit. It should be noted that none of these epoxies cause stress cracking or crazing on polycarbonate.
For more information on Master Bond high strength epoxy adhesives, please contact our technical advisors.
Disclaimer: The findings in this article are not meant to be used for specification purposes.
High Lap Shear Strength Adhesives for Bonding Polycarbonate
 |
EP21ARHT Serviceable from +400°F. Exceptional acid resistance. Cures at room temperature. Good flow properties. 100% reactive. Low shrinkage upon cure. |
 |
EP21LV Epoxy adhesive, sealant, coating resists acids, alkalis and many solvents. Low viscosity room temperature curing. Contains no solvents. Serviceable from -60°F to +300°F. Castable to thicknesses exceeding 2-3 inches. Excellent electrical insulator. |
 |
EP30-2 Cryogenically serviceable. NASA low outgassing approved. 100% reactive. Excellent light transmission properties. Outstanding dimensional stability. High tensile and compressive strength. Successfully tested for 1,000 hours 85°C/85% RH. Excellent dielectric properties. Serviceable from 4k to +300°F. |
 |
Two component, low viscosity, modified heat cured epoxy system for bonding, sealing and coating. Formulated for service at cryogenic temperatures and capable of withstanding cryogenic shock. Meets NASA low outgassing requirements. Optically clear. |
 |
EP31ND Non-drip structural epoxy adhesive. Paste consistency. Gap filling. Unmatched peel and shear strength. Tough and resilient. Protects against exposure to water, oil, fuels. Cures at room temperature. Service temperature range from -60°F to +250°F. |
