Epoxy compounds for relay assembly applicationsLow viscosity epoxy potting and encapsulation compounds feature high performance and easy application in relay manufacturing applications. Master Bond epoxies offer low stress, room temperature cures, resistance to vibration/impact and thermal cycling. Our advanced epoxy formulations ensure durable, long term solutions to help you increase your application productivity.

Key Benefits of Master Bond Potting/Encapsulation Compounds for Relays

Systems are available for use featuring a wide range of hardness. Specific grades have a variety of properties including:

  • Outstanding electrical insulation
  • Thermal conductivity
  • High bond strength
  • Low shrinkage
  • Corrosion resistance
  • Thermal stability
  • Long pot life

Potting/encapsulation compounds are solvent free and contain no diluents. They feature convenient mix ratios and cure schedules. New product developments include faster curing systems and a UL94V.0 flame retardant compound with a halogen free filler.