Adhesives for the Assembly of Electronic DevicesFormulations are available to meet the evolving needs of the electronic industry. Specific grades are available for:

Products include:

Master Bond Electronic Grade Systems Feature Exceptional Performance Properties

Products are easy to apply and available for use in convenient applicators (including premixed and frozen syringes for two component epoxy systems). Properties of specific grades include:

  • High bond strength to similar and dissimilar substrates
  • Low stress
  • High/low temperature serviceability
  • Fast cures
  • Resistance to water and many chemicals
  • Low coefficient of thermal expansion

Silicone Systems Offer Excellent Protection from Mechanical Stress and Temperature Fluctuations

One and two component electronics grade MasterSil® possess high thermal stability, low moduli of elasticity, superior dielectric properties. Other beneficial characteristics of select silicone compounds are as follows:

  • Low shrinkage
  • Thermal and electrical conductivity
  • Low outgassing
  • Chemical inertness
  • Low moisture absorption
  • Vibration damping

No mix UV/visible LIght Curing Compounds for Protection of Electronic Parts

Rapid curing single part solvent free products feature superior bond strength, environmental resistance for electronic assembly applications. Low viscosity compounds for conformal coating and higher viscosity compounds for glob top applications are engineered to resist abrasion, moisture, vibration and thermal cycling exposure.

 

International Microelectronics and Packaging Society Member LogoMaster Bond is a member of the International Microelectronics and Packaging Society.

Microelectronics Packaging & Test Engineering Council LogoMaster Bond is a member of MEPTEC: Microelectronics Packaging & Test Engineering Council.

Surface Mount Technology Association LogoMaster Bond is a member of the Surface Mount Technology Association.

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