Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism.
Not only does it pass USP Class VI tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity,
making it ideal for many applications in the medical device industry.
Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity.
It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability.
Master Bond Supreme 3HTS-80 is a one part, silver filled epoxy adhesive that is not premixed and frozen and features an unlimited working life at room temperature.
“While typical heat activated epoxies require 250°F to 350°F to cure, Supreme 3HTS-80 cures at 175°F to 185°F within 2-3 hours” says Rohit Ramnath, Senior Product Engineer.
Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating.
According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)],
Master Bond LED405Med is a one component, LED curing adhesive system that meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly.
“Since this system does not need a UV light for curing it is intrinsically more user friendly”, says Rohit Ramnath, Senior Product Engineer.
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen.
Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications.
EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.