Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve
as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing,
especially where no flow is needed since the material cures in place and will not run or slump.
Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE),
high glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding,
Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment.
It is not premixed and frozen, and cures with heat. This dimensionally stable system features excellent mechanical properties with both a high modulus and die shear strength.
It transfers heat and resists thermo-mechanical stresses effectively.
Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength
LED light source without any oxygen inhibition. The rate of cure depends upon the intensity of the light source,
Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity
and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance
and good strength properties. As an electrically insulative material, it can be utilized in medical electronic applications.
Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications.
It is capable of withstanding temperatures up to 450°F (232°C), and provides a glass transition temperature (Tg) of 130-135°C.