Master Bond EP38CL was developed for bonding, sealing, coating and encapsulation applications that require toughness and durability. With a Shore D hardness exceeding 75, its toughness is a unique property that imparts resistance to rigorous thermal cycling, impact and mechanical shock.

Formulated with a silver coated nickel filler, Master Bond EP79FL is a two part, electrically conductive epoxy for bonding, sealing and coating applications. It has low volume resistivity of less than 0.005 ohm-cm and is suitable for a variety of uses in the electronic, aerospace, computer, semiconductor and electro-optic industries.

Featuring the combination of electrical insulation properties and thermal conductivity, Master Bond Supreme 3HTND-2GT can be used for a variety of applications including bonding, sealing, glob top and die attach. This toughened epoxy system bonds well to a wide variety of substrates used in electronics, including metals, composites, ceramics and many plastics.

New, easy to read, 32 page catalog offers performance and processing data on Master Bond’s extensive line of epoxy, silicone, polyurethane, silicate based and light curing compounds. These products provide solutions to PCB assembly, die-attach, conformal coating, surface mount, lid sealing, chip and wire bonding applications.

Featuring a thick paste consistency, Master Bond EP21NDFG bonds well to a variety of substrates including metals, composites, glass, ceramics and many types of rubbers and plastics. Unlike many high viscosity systems, EP21NDFG is truly non-drip and will not run or sag, even when applied to vertical surfaces.

In addition to typical silicone properties such as flexibility and high temperature resistance, Master Bond MasterSil 156 passes the rigorous UL 94V-0 tests for flame retardancy. This two part silicone system is addition cured and does not require exposure to air for complete cross-linking. It has a convenient one to one mix ratio by weight and will not outgas while curing.

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