Two Component, Low Viscosity Heat Curing Epoxy Resin System High PerformanceThermal Conductive & Electrical Insulation For Potting & Encapsulation Applications

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two components are combined in a convenient noncritical mix ratio (100/80 by wt) to a moderate viscosity, 100% reactive liquid with a long working (pot) life at ambient temperatures that cures readily at elevated temperatures to a tough strong solid with superior physical strength properties and outstanding thermal conductivity and electrical insulation characteristics. Additional desirable performance qualities are high thermal and dimensional stability, very good thermal shock and vibration resistance, excellent adhesion to metals and a variety of other substrates including glass fibers, ceramics and many plastics. The uniquely formulated chemical composition of the Master Bond Polymer System EP112AO assures remarkably high and durable outdoor electrical insulation properties such as tracking resistance, and dielectrics.

Master Bond Polymer System EP112AO is widely employed for potting, casting and encapsulation applications. Because of the superior retention of its electrical insulation characteristics, formulations based on Master Bond Polymer System EP112AO are successfully employed in electrical insulation applications including post and suspension insulators; high and low voltage transformer bushings; outdoor switchgear components-resistor housings; interruptor tubes and instrument transformers, and in almost any potting or casting application that requires thermal condutive, electrical insulation and high temperature resistant.