One component epoxy for bonding and underfill applications
- Thermally conductive & electrically insulating
- Ultra fine particle size
- Convenient processing
- Meets NASA low outgassing specifications
Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and straightforward; 20-30 minutes at 250°F or 10-15 minute at 300°F. EP3UF is distinguished by being thermally conductive and electrically insulative by using very special filler material with ultra small particle sizes. These granules allow EP3UF to be used as an underfill in spaces as small as 10-15 microns wide. As an underfill system, EP3UF has high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing.
EP3UF also is a highly useful thermally conductive adhesive. Since the filler is thermally conductive and the particle size very small, as mentioned above, it can be applied in thin bond lines of 10-15 microns. This, in effect, lowers the thermal resistance and effectively increases the heat transfer properties of the system. For example, with a typical thermally conductive filler, a reasonable bond line thickness is about 50 microns. With this arrangement, the thermal resistance of this product would be 30-50 x 10-6 K•m2/W. However, when an epoxy such as EP3UF can applied in the 10-15 micron section, the thermal resistance drops to 5-7 x 10-6 K•m2/W. Obviously, this is helpful in managing heat related issues. Some other noteworthy attributes of this system include the ability to bond well to a variety of substrates such as metals, composites, ceramics and many plastics. It has reasonably good resistance to a wide variety of waters, oils and fuels. The color of EP3UF is light yellow. The service temperature range is -60°F to +300°F. EP3UF is a highly effective thermal interface material for bonding and underfill applications in microelectronic packaging and assembly.
- Single component; no mixing needed
- Not premixed and frozen; unlimited working life at room temperature
- Rapid curing with versatile cure schedules
- Can be used as an underfill for very tight spaces
- Small particle size lowers thermal resistance
EP3UF is available is various sizes and units to accommodate customer's needs.