B-staged film for high performance bonding and sealing, NASA low outgassing approved
- High temperature resistant
- Thermally conductive
- Tough and flexible
- Easy to apply and doesn’t require freezing
- Excellent electrical insulation properties
- Uniform bond line thickness
Master Bond FLM36-LO is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. Functionally, it is similar to EP36AO and both that product and this film differ from other heat resistant epoxies as they possess far more toughness and flexibility than conventional high temperature epoxies. This highly unusual system has a relatively low glass transition temperature, and although softer above it, FLM36-LO retains its very high physical strength properties profile up to 500°F. Ultimately, FLM36-LO combines markedly enhanced thermal and mechanical shock resistance and thermal cycling capabilities. FLM36-LO bonds well to a variety of substrates including metals, composites, glass and many plastics. It has good chemical resistance to water, acids, bases, fuels and oils. The service temperature range is -100°F to +500°F. Being a film, it, of course, doesn’t require any mixing. The processing is very straightforward, that is heat curing at 350°F for 1-2 hours in order to obtain optimal properties. Two outstanding and highly desireable features of FLM36-LO include its uniformity of bond line thicknesses and limited squeeze out during the bonding process. An additional noteworthy characteristic is its low outgassing conformity to the NASA ASTM E595 specification.
This product is offered in three standard sizes: FLM36-LO-4A is 4 x 4 x 0.008 inches, FLM36-LO-8B is 8 x 8 x 0.008 inches and FLM36-LO-12C is 12 x 12 x 0.006 inches. The film can be cut with a pair of scissors into various shapes and sizes. With intricate shapes, preforms can be provided; although, a technical drawing with tolerances would be required. The films are rugged, durable and not prone to cracking. Using the film is simple. The films have release paper on each side. After the substrates are surface prepared, the release paper is removed on one side to expose the adhesive. It’s carefully placed onto the part and pressure is applied. The film is adhering to the surface as it possesses a “tackiness” to it. The second release lining is removed and the other substrate is affixed accordingly.The assembly is lightly fixtured and cured for 1-2 hours at 350°F. The bonded parts should be returned to 75°F before removing the fixtures.
The film is black in color to provide a vivid contrast from the release papers. Unlike nearly all the thermoset films of this type, FLM36-LO does not require freezing, although refrigeration is recommended. The plethora of advantages in using this film with its unique flexibilized epoxy chemistry is that it offers high temperature resistance, extraordinary toughness and flexibility, the ability to withstand rigorous thermal cycling and the distinction of complying with NASA low outgassing criteria. These properties enable it to be an excellent candidate for aerospace, electronic, opto-electronic, specialty OEM and applications requiring vacuum compatibility. Also, its thermal conductivity and electrical insulation properties are integral constituents of the product property profile of FLM36-LO.
FLM36-LO is available is various sizes and units to accommodate customer's needs.