One part, low outgassing, low stress silicone system for coating, sealing & encapsulating

Key Features

  • Meets NASA ASTM E595
  • Moderate viscosity with good flow properties
  • Neutral type cure
  • Superb optical clarity

Product Description

MasterSil 920-LO is a high performance, RTV silicone for sealing, coating and small encapsulations. First and foremost, it meets NASA low outgassing specifications. It is a neutral curing, non-corrosive type system. Also it has very good flow properties and outstanding electrical insulation values. These properties facilitate its use as a conformal coating and encapsulation system. With a softer durometer than many other silicones, it is particularly well suited for protecting sensitive electronic components. In fact, since it is low outgassing and optically clear, it can be used for select optical applications where delicate components must be protected. Similar to other one part silicones, the curing mechanism is based on humidity; the higher it is, the faster the cure. Also thinner sections cure more quickly than thicker ones. Another noteworthy property is its wide service temperature range of -175°F to +500°F. MasterSil 920-LO bonds very well to a wide variety of substrates including metals, glass as well as many plastics and rubber materials. With its inherent robust flexibility, the system can withstand the most rigorous kinds of thermal cycling and shock. MasterSil 920-LO is a “go-to material” in the encapsulation of sensitive electronic and optical components, especially when low outgassing and low stress are critical requirements. It should be noted, in order to achieve the low outgassing properties, a seven day cure at room temperature is recommended.

Industrial Certifications

ASTM E595 Compliant

Meets EU Directive 2015/863



MasterSil 920-LO is available is various sizes and units to accommodate customer's needs.

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Master Bond Silicone Adhesive System MasterSil 920-LO

NASA low outgassing compliant, MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement.

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