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Technologically advanced epoxy formulations play an essential role in the protection of electronic components. As applications become increasingly demanding, the need for higher performing systems grows more critical. Master Bond has met this challenge.

Benefits of Master Bond Potting and Sealing Solutions for Electronic Components

Among the most important advantages are:

  • Vibration, shock and impact resistance
  • Thermal conductivity
  • Outstanding electrical insulation properties
  • Low shrinkage
  • Resistance to corrosive agents
  • Excellent adhesive strength
  • High/low temperature resistance
  • Low viscosity

Properties of Our Polymer Systems

Potting and Sealing of Electronic Components

Master Bond offers one and two component systems available in a range of hardnesses, viscosities and cure speeds. Specific grades offer:

  • Low exotherm
  • Superior moisture resistance
  • High glass transition temperatures (Tg)
  • NASA low outgassing approval
  • UPS Class VI certified for biocompatibility
  • Dimensional stability
  • Excellent dielectric properties
  • UL 94V-0 approved for flame retardancy
  • Long working life