This wide range of adhesive compounds meet NASA low outgassing specifications and feature their own unique set of high performance properties such as optical clarity, thermal conductivity, cryogenic serviceability and more.
Browse through this infographic to learn about our top performing NASA low outgassing approved systems.
NASA Low Outgassing Approved Adhesives Systems
Silver filled electrically conductive epoxy has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive with incredibly low thermal resistance. Smooth paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +450°F.
Cryogenically serviceable. NASA low outgassing approved. 100% reactive. Excellent light transmission properties. Outstanding dimensional stability. High tensile and compressive strength. Successfully tested for 1,000 hours 85°C/85% RH. Excellent dielectric properties. Serviceable from 4k to +300°F.
Specialty type UV curable adhesive with very fast curing time and high thermal stability. Its glass transition temperature is 160 to 170°C and its service temperature range is -60°F to +500°F. UV26 resists acids, bases, fuels, and many aggressive solvents.
Dual cure system with UV and heat curing mechanisms. Cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Serviceable from -60°F to +350°F.
RTV silicone for sealing, coating and small encapsulation. NASA low outgassing approved. Superb optical clarity. Good flow properties. Non-corrosive. Soft durometer facilitates usage with sensitive components. Excellent electrical insulator. Withstands thermal cycling.
Optically clear, addition curing potting, encapsulation, sealing compound. Low shrinkage upon cure. Resists up to +400°F [+204°C]. Shore A hardness 50-60. Highly resistant to water. Long pot life. Primarily in thermal management applications.