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LATEST PRODUCT

Thixotropic Epoxy Features Low Coefficient of Thermal Expansion

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of...

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TECH TIPS

Surface Wetting
Adhesives for Bonding of Honeycomb Sandwich Panels
Adhesives for Remanufacturing
Panel Bonding
Seam Sealing

LATEST WHITE PAPER

Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the...

INDUSTRIAL CERTIFICATIONS

USP Class VI for biocompatibility
ISO 10993-5 for cytotoxicity
NASA low outgassing
FDA CFR 175.300 & 175.105
MIL-STD-810G for fungus resistance
MIL-STD-883J for thermal stability
FAR 25.853(a) for flame retardancy
UL 94V-0 & UL 94V-1
UL 1203 for explosion-proof
85°C/85% RH
See all certifications

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