The unique requirements of microelectromechanical systems (MEMS) call for specialized materials. Versatile epoxy adhesives are often capable of providing the necessary properties to ensure support and protection from thermal and mechanical shock, vibration, and other physical damage.
Film adhesives are an alternative to liquid adhesives. Read more about the advantages that these unique epoxies offer and why they are often preferred over their conventional counterparts. If your application involves a large surface to be joined or if squeeze out may pose a problem, download this white paper today.
Selecting the right adhesive is a balancing act as engineers attempt to find products that meet conflicting end-use and manufacturability requirements. Medical device engineers also have to contend with a strict regulatory environment, and therefore often have the toughest time striking that balance.
The assembly applications for medical device manufacturers typically come with their own distinctive set of rigorous requirements. This white paper takes a closer look at one and two part silicone medical adhesives.
Advanced power and high frequency communications electronics have become more sophisticated. Fabricating and assembling these devices involves carefully selecting the proper adhesives, die attach compounds, glob-top encapsulants, underfills and potting compounds. Engineers must be familiar with how these systems can affect design so that they meet and exceed performance objectives.
Forming reliable bonds between different materials can be challenging because there can be large variations in CTE's (coefficients of thermal expansion). Adhesive compounds play a critical role in the fabrication of assemblies for electronic, optical and mechanical systems.