Potting compounds offer superior protection for electronic circuits while encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions.
Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems.
The use and selection process of thermally conductive epoxies can make or break your application. Too much heat can lead to component malfunction or premature component failure while the inability to stay below specified temperature limits may result in irreversible damage and permanent performance shifts.
Whereas once mechanical fasteners may have been the assembly option of choice, tremendous strides in polymer chemistry over the past few decades have made epoxy resins technically and economically superior. In this white paper, we explore the various performance characteristics of adhesive technologies and their use in modern applications across many industries.
Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.
Glob top encapsulations are often preferred for their ability to protect chips without damaging fragile wires. They are formulated to exhibit specific physical properties such as electrical insulation, resistance to moisture and chemicals and thermal conductivity, to name a few.